A brief analysis of the working principle of the dual-color light-emitting diode

Date:2025-03-18 Categories:Industry News Hits:849 From:Guangdong Youfeng Microelectronics Co., Ltd(YFW)


Light-emitting diodeLED) encapsulation glue usually refers to the medium between the LED chip and the external environment, which is used to fix and protect the LED chip. Abnormal conditions of LED encaps glue may affect the performance and reliability of the LED. Here are some possible abnormal conditions and their possible causes: 1. Bubbles: The appearance of bubbles in the encaps glue may be due to uneven stirring, insufficient vacuum, or improper temperature control during the packaging process. 2. Gel: Incomplete solidification of the encapsulation glue may be to insufficient addition of curing agent or insufficient curing time. 3. Cracks: The appearance of cracks in the encapsulation glue may be due to excessive internal stress, temperature changes, or external force. 4. Color change: The discoloration of the encapsulation glue may be due to oxidation of the material, long-term exposure light, or improper use of environmental conditions. 5. Insufficient adhesion: Insufficient adhesion of the encapsulation glue may cause the LED chip to be fixed loosely affecting its heat dissipation performance and stability. To solve and improve these abnormal conditions, the following measures can be taken: 1. Optimize the production process to ensure that theulation glue is evenly mixed, the vacuum is sufficient, and the temperature and humidity are strictly controlled. 2. Increase the amount of curing agent, extend the curing time and ensure that the encapsulation glue is completely solidified. 3. Optimize the design structure to reduce internal stress and improve the adaptability to temperature changes. 4. high-quality encapsulation glue materials, avoid exposure to strong light and harsh environments. 5. Select encapsulation glue with appropriate adhesion to ensure close bonding between the LED chip the substrate. In summary, abnormal conditions of LED encapsulation glue may affect the performance and stability of the LED, so it is necessary to strictly control various parameters during production and, and take effective measures for improvement and adjustment in time.




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